LCP Liquid Crystal Polymer Packages by RJR Polymers

RJR Polymers is a leader and innovator in electronic component packaging technology, offering the industry's most advanced products and processes, and providing unique, total solutions in Adhesive Technology, Automation Systems, and Air Cavity Packages. Our comprehensive applications portfolio includes microwave, cellular/RF, optical image sensors, aviation, automotive and informational systems.

Our unique ability and understanding of how to marry materials, application processes and new packaging technologies has resulted in unique solutions that benefit our clients, including Hewlett Packard, Ericsson, Motorola, IBM, and Philips.

LCP Liquid Crystal Polymer Microelectronic Packaging

Recognized as the next valuable tool in providing product flexibility, performance enhancement(s), product integration and cost reduction. RJR LCP Liquid Crystal Polymer Packages provide equitable to higher levels of performance for a package cost that is less than industry standard pricing. Read More about LCP Liquid Crystal Polymer Packages

• RF Packages
• QFN Packages
• Optical Packages
• Air Cavity QFN Packages

Air Cavity Packages

Plastic Air Cavity Package: An air cavity package is a chip containment system consisting of a structural base, a die attach pad, Leadframe and Lid. After die and wire bonding, a cover is affixed using adhesive to provide environmental and mechanical protection for the die and wire bonds without touching either of these components. RJR Polymers also supplies lids with pre-applied adhesives.

Our air cavity plastic base package provides several important advantages when compared to: (a) Ceramic Air Cavity Packages or (b) transfer-molded packages that encapsulate the die and wire bonding.

1. Equal or superior high-frequency operation.
2. Faster turnaround time for Prototype designs at substantially lower tooling cost.
3. Substantially cheaper or very cost competitive replacement option.

With regard to our metal bottom (thermal enhanced) Plastic Package, other important advantages are:

1. Improved heat dissipation
2. High thermal conductivity means lower die operating temperature and longer life

We refer to our package technologies as R-Pak®. Included in our R-Pak® family are our Vision (Sensor) packages, our Thermally-Enhanced packages and our full plastic body packages.

Thermally Enhanced Microelectronic Packages

Our Vision or sensor type Package is a family of packages that satisfy the high-performance needs of the optical imaging section of the semiconductor industry for devices such as CCD, CMOS, etc. RJR supplies companion windows with pre-applied adhesives tailored to fit its package configurations. RJR also supplies semi-automatic and automatic robotics sealing equipment (See Automation Systems) to seal the window to the Package Header.

The package construction consists of a high temperature polymer alloy which is insert molded around a lead frame. Standard, off the shelf materials do not have the combination of temperature resistance, bondability, low shrinkage and low CTE needed for structurally sound package bodies which do not leak. Our specially designed Polymer Alloy and patented Package Construction System assures leak free sealed packages with "high" yield and reliability.

Custom configurations can also be produced. Contact your local sales representative for further information.

Low Costs / Fast Turnaround Time

Air Cavity Package Technology
Prototypes can be produced in approximately 8 to 12 weeks depending on the design requirements. Tooling costs can be as little as ,000 to produce 500 packages in leadframe format (Vision type packages with etched leadframe, laser dam bar removal, but does not include the cost for trim and formatting, etc.) or as much as ,000 (R-Pak® that needs a package based and lid tooled, dam bar removal tooling, trim and form tooling, etc.) In some cases (depending on the design), this prototype tooling can be used to produce production parts during the ramp up period while the customer is waiting for a full production tool.

Vision Package
The tooling cost to produce a single cavity prototype production tool is approximately US to 15K and takes up to 8 to 12 weeks to produce. This includes the cost for the package tooling, etched leadframe and window design but does not include the cost of trim and form tooling. Typical turn around time is 12 to 16 weeks to deliver the first article of production parts after approval of the prototype packages. Mass production tooling for the package is approximately USK. Typical turn around is approximately 20 weeks. This does not include the cost of trim and form and stamped leadframe tooling.

Thermally Enhanced Package
A major cost advantage is the low tooling cost for both prototype and production requirements and the FAST turnaround. For around USK and in around 20 weeks, mass production deliveries can start. We think of mass production as being anything over 100K/week. This includes the cost for tooling both the package body and lid. Prototypes can cost closer to USK which excludes the cost of dam bar, trim and forming tooling and stamped leadframe. Turn around time for prototype packages is 8 to 12 weeks.

See our FDB ad page for:

http://fdbnetwork.com/microelectronic-package-solutions