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LCP Liquid Crystal Polymer Packages by RJR Polymers
Europe's Premier Microwave, RF, Wireless and Radar Event
European Microwave Week 2009 continues the series of successful microwave events, following Amsterdam (1998, 2004, and 2008), Munich (1999, 2003, and 2007), Paris (2000 and 2005), London (2001), Milan (2002), and Manchester (2006) with its 12th Exhibition and Conference Week. The 2009 event will be held in Rome, Italy for the first time ever.
IMAPS leads the Microelectronics Packaging, Interconnect and Assembly Community, providing means of communicating, educating and interacting at all levels.
The Minerals, Metals & Materials Society (TMS) is a rare professional organization that encompasses the entire range of materials and engineering, from minerals processing and primary metals production to basic research and the advanced applications of materials.
The important issues in advanced area-array electronic packaging for semiconductor devices are materials driven. Some of the processing-driven materials issues include the effect of introducing a silicon device interface with copper pads and a low- dielectric, the effect of decreasing pitch and feature size on the package interconnects, the development and implementation of organic substrates, and advanced underfills for fine-pitch flip-chip applications. From a materials reliability aspect, important materials issues include enhanced solder interconnect reliability, -particle-induced soft errors, and the introduction of lead-free solder alloys.
This poster paper will present thee physical, electrical, and thermal characteristics of the base materials. The packages described will include thermally enhanced LDMOS made of LCP using a three tier assembly system, partially matched RF packages based on the electrical properties of LCP and leaded packages using a 48 and 52 pin CCD/CMOS configurations as a models.
The LCP (liquid crystal polymer) is a class of high performance, high temperature thermoplastic polymers which can be formulated to provide injection molding compounds having properties uniquely advantageous for electronic cavity packages.
Strong demand for smaller and thinner electrical components that must withstand higher temperatures is pushing the envelope for suppliers of liquid crystal polymers (LCPs). This trend has prompted development of a new range of ultra-high-heat materials that boast high flow for thinner walls and faster cycle times in lead-free, surface-mount connectors.
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